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Low Chlorine High Purity Phenolic Novolac Epoxy Resin for Semiconductor Packaging & LED Encapsulation NPPN-638S

Low Chlorine High Purity Phenolic Novolac Epoxy Resin for Semiconductor Packaging & LED Encapsulation NPPN-638S

Brand Name: DAHUA
Model Number: NPPN-638S
MOQ: 4400 kilometers
Price: $3.18/kilometers 4400-17599 kilometers
Packaging Details: 220kg/drum,17600kg/80drums/20pallets/20FCL
Payment Terms: T/T
Detail Information
Place of Origin:
Guangdong, China
Certification:
ISO 9001, ROHS, REACH
CAS No.:
28064-14-4
Type:
Liquid Epoxy Resin
Main Raw Material:
Phenolic Novolac Epoxy Resin
Physical State:
Semi Solid
Epoxy Equivalent Weight G/eq:
175~195
Hydrolyzable Cl Ppm:
<100
Total Chlorine Ppm:
<300
Gardner:
Max 1.5
Usage:
Semiconductor Packaging, Electronic Encapsulation
Highlight:

low chlorine epoxy resin

,

high purity novolac resin

,

NPPN-638S epoxy resin

Product Description
Product Description
Low Chlorine High Purity Phenolic Novolac Epoxy Resin NPPN-638S

1, General Description
NPPN-638S is an ultra-high-purity phenolic novolac epoxy resin manufactured through an advanced post-reaction purification process that reduces hydrolyzable chlorine content below 100 ppm and total chlorine below 300 ppm. These exceptionally low ionic impurity levels are achieved through a proprietary multi-stage washing and distillation sequence that removes residual epichlorohydrin, chlorinated byproducts, and ionic species. NPPN-638S meets the most stringent purity requirements of the semiconductor and microelectronics industries, where ionic contamination can cause catastrophic device failure through metal migration, wire bond degradation, and leakage current increases. Each batch is certified with full traceability including ICP-MS analysis for 12 critical metal ions.

2, Chemical Composition:
Phenolic novolac epoxy resin
 
3, Sale Specification & Typical Properties:
Quality Unit Range
Physical State-Semi Solid
Epoxy Equivalent Weightg/eq175-195
ColorGardnerMax 1.5
Hydrolyzable Clppm<100


4, Application:
NPPN-638S is essential for applications where ionic purity directly impacts reliability:
1. Epoxy molding compounds (EMC) for semiconductor IC packaging (QFN, BGA, CSP).
2. Glob-top encapsulants for COB (chip-on-board) assemblies.
3. Underfill materials for flip-chip packages.
4. High-reliability PCB laminates for aerospace and medical electronics.
5. Conductive and die-attach adhesives for LED and power device assembly.
6. Potting compounds for automotive power modules and high-voltage IGBT modules.


7. LED encapsulation compounds with excellent light transmittance and thermal stability.
8. Direct supply from China manufacturer with competitive wholesale pricing.
9. Epoxy equivalent weight 175-195 g/eq for balanced reactivity and low stress cure. 5, Storage properties:
At least 12 months in sealed containers at ambient temperature.

6, Handing precautions:
Product may cause skin and eye irritation. In cases of skin contact wash immediately with soap and water. For eyes, flush with plenty of water for 15 minutes and seek medical attention immediately.
 
7, Packaging
220kg/drum,17600kg/ 80 drums/ 20pallet, 17,600kg/20Fcl

9, FAQ

Q: What documentation is provided with each shipment of NPPN-638S?
A: Each batch includes CoA with EEW, viscosity, hydrolyzable Cl, total Cl, Gardner color, and ICP-MS trace metal analysis for Na, K, Fe, Cu, Ni, Cr.

Q: Is NPPN-638S compatible with silver-filled conductive adhesives?
A: Yes, the low ionic content minimizes silver migration risk, making it an excellent choice for conductive die-attach formulations.

Q: What is the shelf life of NPPN-638S?
A: 12 months at 15-25C. EEW and viscosity are monitored for drift. Refrigerated storage can extend life to 18 months.

Payment & Shipping Terms
Minimum Order Quantity
4400 kilometers
Price
$3.18/kilometers 4400-17599 kilometers